Material
316L Stainless Steel
Tolerance
±0.005mm
Process
CNC Machining
Lead Time
3-5 Days
Surface Finish
Passivation
AI server liquid cooling connectors are precision-engineered components manufactured from 316L stainless steel, featuring superior corrosion resistance for demanding cooling applications. Designed specifically for high-density AI computing environments, these connectors maintain excellent thermal performance while ensuring absolute leak-free performance under high-pressure conditions.
The manufacturing process utilizes 5-axis CNC machining centers to achieve precise tolerances of ±0.005mm on critical sealing surfaces. Each connector undergoes rigorous quality testing, including 100% pressure testing at 4.5 MPa and dimensional verification using CMM equipment. The result is a reliable cooling solution that meets the demanding requirements of modern data centers and AI computing facilities.
Surface treatment includes passivation for enhanced corrosion resistance, providing excellent protection against coolant chemicals and environmental factors. With a thermal conductivity of 16.2 W/(m·K) and operating temperature range from -40°C to +120°C, these connectors deliver reliable heat dissipation for AI servers, GPU clusters, and high-performance computing equipment. We support rapid prototyping (3-5 days) and high-volume production (50,000+ units/month).
Liquid cooling for AI training servers and inference platforms with high-density GPU configurations
Cooling infrastructure for cloud computing facilities and enterprise data centers
High-performance computing clusters for machine learning and scientific computing applications
Electric vehicle battery thermal management systems and energy storage solutions
Cooling systems for industrial automation, robotics, and manufacturing equipment
Thermal management for power converters, inverters, and electrical systems
AI server liquid cooling connectors are precision-engineered components manufactured from 316L stainless steel, featuring superior corrosion resistance for demanding cooling applications. Designed specifically for high-density AI computing environments, these connectors maintain excellent thermal performance while ensuring absolute leak-free performance under high-pressure conditions.
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